The conference focuses on leading edge research on integrated optics, opto-electronics and nanophotonics and gathers experts from academia and industry to show their latest technical results, and showcase their products and services. The application scope is broad and it ranges from telecom/datacom to optical sensing applications including more disruptive areas such as quantum and neuromorphic computing.

Conference topics cover waveguide technology and platforms, devices and materials, integrated circuits and applications of photonic integrated circuits (PICs). The most recent advances in photonic integration technologies, such as silicon photonics and III-V optoelectronics, is one of the main features of the conference. Assembly, packaging and hybrid integration techniques are also covered. In addition, the conference aims to discuss novel concepts on materials with unique properties such as 2D materials or phase change materials.

A more detailed list of conference topics includes:

  • Waveguide technology and platforms: Silicon photonics | III-V optoelectronics | Hybrid & heterogeneous integration | Compound semiconductors | Membrane photonics, wafer and die bonding technologies |Dielectric and polymer photonics | Nonlinear and electro-optic materials | Mid and far infrared, THz | Production methods and foundry concepts | Novel coupling techniques of photonic integrated circuits and special optical fibers 

  • Devices and materials: Waveguide devices – fibres, waveguides, multiplexers, diffractive optical elements | Functional devices – switches, buffers, programmable filters, isolators, polarizers | Nonlinear devices – wavelength converters, mixers and regenerators | Plasmonic waveguides and devices | Novel devices based on magneto-optic and ferroelectric materials | Nanophotonics, photonic crystals, subwavelength and metamaterials | Active devices – lasers and laser arrays to ampliers, modulators and detectors | New Materials for Photonics– graphene and 2D materials, phase change materials | Novel modeling and simulation techniques

  • Integrated Circuits: Assembly, packaging and hybrid integration techniques | Test and characterisation of photonic integrated circuits | Optical connectivity – fiber-attachment, waveguides, micro-benches and free-space | Electronic connectivity | Flip-chip bonding | Quantum and high precision photonics | Optomechanical devices and micro- and nano-electro-mechanical systems | Novel modeling and simulation techniques

  • Applications of PICs: Tele/data communication, optical interconnects | Biological, chemical and other sensing transducers | Spectroscopy | Quantum computing | Free-space optical communications, LIDAR | Photonic A/D conversion, logic, memories | Data display and beyond